您現(xiàn)在位置：首頁 > 產(chǎn)品中心 >Logitech精密材料表面處理>精密切割設(shè)備
| 產(chǎn)品圖片 | 產(chǎn)品名稱/型號(hào) | 產(chǎn)品描述 |
-
The AWS1 Abrasive Wire Saw allows fragile or diffi cult materials to be cut or wafered without fear of the samples being damaged. Designed for use in photonics, semiconductor, opto-electronics -
The APD1 is a combined annular and precision saw ideal for slicing wafers, crystals or semiconductor components up to 55mm in diameter. It is also suitable for precision dicing of wafers up to 100mm -
The GTS1 Thin Section Cut-off and Trim Saw is ideal for geological application areas - cutting hard or soft rocks, concretes or cements with equally high effi ciency.
共 3 條記錄，當(dāng)前 1 / 1 頁 首頁 上一頁 下一頁 末頁 跳轉(zhuǎn)到第頁
